EENG 393
Lab 12 - Soldering skills
InLab 12
Some self-guided
activities.
Objectives
- Through hole soldering with soldering iron,
- SMT soldering using reflow skillet,
Lab 12 assignment
Assemble your power supply PCB and provide a temperature profile for the
PCB.
Turn-in
- Assemble your power supply
- Graph the temperature profile of your PCB on the reflow skillet
while its being reflowed. Do this by completing the following
- Measure the temperature of the PCB every 30 seconds
using the FLIR thermal imaging camera,
- Open Excel and enter "Time" in cell A1. Enter 0 in
cell A2 and "=A2+30" in cell A3. Click on cell A2, click
on the small square in the lower right corner and drag
the formula down to cell A17,
- Enter the recorded temperatures in cells B2 … B17,
- Select cells A1 to B17,
- Insert → Charts → Scatter → Scatter with
smooth lines and markers.
You will have to learn how to use the FLIR TG165 on your own - don't worry
it's pretty simple. If you like reading, check out the
FLIR TG165 USER MANUAL.
I found pages 6-12 to be most relevant. The distance to spot ratio was
particularly important. If you like watching videos, then check out the
FLIR TG165 video playlist