Current Processing Techniques

• RF Magnetron Sputtering
  • Key is fabrication of the target
  • Reactive sputtering: Metal target, O2 Ambient
  • Requires high temperature anneal (> 400 ºC)
  • High vacuum process ~10-4 torr

• Atmospheric Pressure CVD
  • High substrate temperature, high throughput
  • Requires volatile precursor, limited to tin oxide

• Spray Pyrolysis
  • Dissolve precursors in water/alcohol solutions
  • Lower quality, uniformity

Common Limitation

High Substrate Temperature

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